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  1. Techstar Innovations specialises in Gold Wire Bonder, Die Bonder, Flip chip Bonder, Aluminium Wire Wedge Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, ...

    A specialist in semiconductor Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Aluminium Wire Wedge Bonder, Auto ...
    wire bonding1
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    aluminium wedge bonder0
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    semiconductor wire bonders0
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    ultra fine pitch wire bonders0
    ultra fine pitch wire bonding0
    Wire Bondings0

    www.techstar-i.com - 2009-02-07

  2. Hesse & Knipps

    Hesse & Knipps - Automation solutions for the production in the semiconductor industry High-tech standard products and customer-oriented developments for ...
    ultraschall2
    bonder1
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    www.hesse-knipps.com - 2009-02-07

  3. Welcome to the Frontpage

    Laser Bar Bonder
    Bonding2
    Die Bonder1
    Flip chip Bonder1
    Laser Bar1

    www.laser-bar-bonder.com - 2009-02-09

  4. Automatic Flip Chip Bonder - Made in Germany - FINEPLACER

    FINETECH presents the newest flip chip bonder in the award-winning FINEPLACER® family - Opto-Bonder® FEMTO
    Bonding2
    Opto1
    micro optics1
    Flip Chip Bonder1
    Laser Bar Bonding1
    Power Laser1
    VCSEL bonding1
    bonding process1
    post bond accuracy0

    www.opto-bonder.com - 2009-02-04

  5. Welcome to Laurier Incorporated - Manufacturer of Die Sorting and Tray Handling equipment.

    Laurier Inc. of Londonderry, NH has built the largest installed base of semi-automatic and fully automated die sorting systems in the world. Laurier also ...
    Inc.3
    Manchester3
    New Hampshire3
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    die trays1
    flip chip sorting1
    LED sorting1
    precision die attach1
    precision flip chip bonder1
    WLCSP sorting1

    www.besidiehandling.com - 2009-02-07

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